Contents
               Process Description, Part I
               Cross section overview
               Key process features
               MPW process step-by-step
               Process Description, Part II
                Process Description, Part II
               Absolute limitations
                Absolute limitations
               Process monitors
                Process monitors
               Test data
                Test data
                                                    Slide 2
               Cross section 
               overview 
                                        Slide 3
                            Silicon 
                            Micromachining
      Micromechanics in silicon is here defined as three-
        dimensional micromachining in single crystal 
        silicon by means of photolithographic etching 
        techniques.
          This definition covers most techniques used to make 
            micromechanical sensors, although in some cases 
            additive structures such as polysilicon and silicon 
            dioxide also have been micromachined by selective 
            etching techniques, and in some cases mechanical 
            drilling or other machining methods are used.
      Crystal Structure of Single Crystal Silicon
      Isotropic and anisotropic etching
      etc
                                                                          Slide 4
                          Silicon 
                          Micromachining
      Micromechanics in silicon is here defined as three-
        dimensional micromachining in single crystal 
        silicon by means of photolithographic etching 
        techniques.
          This definition covers most techniques used to make 
            micromechanical sensors, although in some cases 
            additive structures such as polysilicon and silicon 
            dioxide also have been micromachined by selective 
            etching techniques, and in some cases mechanical 
            drilling or other machining methods are used.
      Crystal Structure of Single Crystal Silicon
      Isotropic and anisotropic etching
      etc
                                                                          Slide 5
                            Crystal Structure of 
                            Single Crystal Silicon
        It is a face-centred 
         cubic structure 
         (diamond structure) 
         with two atoms 
         associated with 
         each lattice point of 
         the unit cube. 
        One atom is located 
         in position with xyz 
         coordinates (0, 0, 
         0), the other in 
         position (a/4, a/4, 
         a/4), a being the 
         basic unit cell 
         length.
        It is best to use a 
         “hardware” model 
         to see it in 3 
         dimensions
                                                                               Slide 6